Global Solder Paste Market Research Report 2016 by Manufacturers, Regions, Type and Application, Forecast to 2021
Global Solder Paste Market Share and Growth, focuses on top players in these regions/countries, Size, Share, Demand, Analysis, Manufacturers, Type and Application, Forecast 2016 to 2021
This report provides detailed analysis of worldwide markets for Solder Paste from 2011-2016, and provides extensive market forecasts (2016-2021) by region/country and subsectors. It covers the key technological and market trends in the Solder Paste market and further lays out an analysis of the factors influencing the supply/demand for Solder Paste, and the opportunities/challenges faced by industry participants. It also acts as an essential tool to companies active across the value chain and to the new entrants by enabling them to capitalize the opportunities and develop business strategies.
Solder paste (or solder cream) is used to connect the leads of surface mount integrated chip packages to attachment points (lands) in the circuit patterns on a printed circuit board. The paste is typically applied to the lands using a stencil to “print” the paste (although other methods, like dispensing from a tube, are also used), followed by heating to melt the paste, fusing the connection. A solder paste is essentially powdered metal solder suspended in a thick medium called flux. Flux is added to act as a temporary adhesive, holding the components until the soldering process melts the solder and makes a stronger physical connection. The paste is a gray, putty-like material. The composition of the solder paste varies, depending upon its intended use. For example, when soldering plastic component packages to a FR-4 glass epoxy circuit board, the solder compositions used are eutectic Sn-Pb (63 percent tin, 37 percent lead) or SAC alloys (tin/silver/copper, named for the elemental symbols Sn/Ag/Cu). If one needs high tensile and shear strength, tin-antimony (Sn/Sb) alloys might be used with such a board. Generally, solder pastes are made of a tin-lead alloy, with possibly a third metal alloyed, although environmental protection legislation is forcing a move to lead-free solder.
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GCC’s report, Global Solder Paste Industry Report 2016, has been prepared based on the synthesis, analysis, and interpretation of information about the global Solder Paste market collected from specialized sources. The report covers key technological developments in the recent times and profiles leading players in the market and analyzes their key strategies. The competitive landscape section of the report provides a clear insight into the market share analysis of key industry players. The major players in the global Solder Paste market areQualitek, ITW, INDIUM, Fusion, ALENT, AIM, Henkel, Heraeus, Asahi, Tamura, Senju, Heesung Material, Nordson.
The report provides separate comprehensive analytics for the North America, Europe, Asia-Pacific, Middle East and Africa and Rest of World. In this sector, global competitive landscape and supply/demand pattern of Solder Paste industry has been provided.
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Table of Contents
Part 1. Scope of Report
1.1 Research Methodology
1.2 Geographic Scope
1.3 Years Considered
Part 2. Introduction
2.1 Key Findings
2.2 Value Chain Analysis
Part 3. Manufacture
3.1 Manufacturing Process
3.2 Issues and Trends
Part 4. Cost Structure
4.1 Bill of Materials
4.2 Labor Cost
4.3 Depreciation Cost
4.4 Manufacturing Cost
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