Global Flexible Copper Clad Laminate (FCCL) Market Research Report 2016 by Analysis, Size, Share, Growth, Trends, and Forecast to 2021

Global Flexible Copper Clad Laminate (FCCL) Market Segment, Types, Revenue, Price, Market Share and Growth, focuses on top players in these regions/countries, Size, Demand, Analysis, Growth, Trends, and Forecast 2016 to 2021

This report provides detailed analysis of worldwide markets for Flexible Copper Clad Laminate (FCCL) from 2011-2016, and provides extensive market forecasts (2016-2021) by region/country and subsectors. It covers the key technological and market trends in the Flexible Copper Clad Laminate (FCCL) market and further lays out an analysis of the factors influencing the supply/demand for Flexible Copper Clad Laminate (FCCL), and the opportunities/challenges faced by industry participants. It also acts as an essential tool to companies active across the value chain and to the new entrants by enabling them to capitalize the opportunities and develop business strategies.

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FCCL is a substrate mainly used for processing flexible printed circuit board(FPC). And it is divided into two categories: the traditional three-layer soft board substrate (3L FCCL) containing adhesive and the new two-layer soft board substrate (2L FCCL) contains no adhesive. Apart from features such as excellent dielectric, bond strength, dimensional stability, flexible copper-clad laminate has prominent features as follows: (1) flexible, can be used to dynamic connection; (2) three dimensional wiring, reducing circuitry space. Flexible laminates are available in a broad range of copper clad constructions using a wide variety of base dielectrics. These laminates are available in either adhesive based or all polyimide form. Adhesive based clads, also known as 3-layer. All polyimide clads, also known as 2-layer, are available either as double-sided using a lamination based manufacturing process or single sided utilizing cast technology.

GCC’s report, Global Flexible Copper Clad Laminate (FCCL) Market Outlook 2016-2021, has been prepared based on the synthesis, analysis, and interpretation of information about the global Flexible Copper Clad Laminate (FCCL) market collected from specialized sources. The report covers key technological developments in the recent times and profiles leading players in the market and analyzes their key strategies. The competitive landscape section of the report provides a clear insight into the market share analysis of key industry players. The major players in the global Flexible Copper Clad Laminate (FCCL) market areNippon Steel & Sumikin Chemical, Ube Industries, Arisawa, Synflex, NIKKAN, Kyocera, Panasonic Corporation, Dupont, Doosan, Hanwha L&C, Innox Corporation, SK Innovation, LG Chem, LS Mtron, Cheil Industries, SD Flex, Toray Advanced Materials, Taiflex Scientific, Microcosm Technology, ThinFlex, Asia Electronics Materials (AEM), AZOTEK, RCCT TECHNOLOGY, Jiujiang Flex, Guangdong Shengyi, Grace Electron, Shandong Laiwu Jinding, DMEGC, Zhongshan Dongyi, Allstar Tech.

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The report provides separate comprehensive analytics for the North America, Europe, Asia-Pacific, Middle East and Africa and Rest of World. In this sector, global competitive landscape and supply/demand pattern of Flexible Copper Clad Laminate (FCCL) industry has been provided.

Table of Contents
Part 1. Scope of Report

1.1 Research Methodology
1.2 Geographic Scope
1.3 Years Considered

Part 2. Introduction
2.1 Key Findings
2.2 Value Chain Analysis
2.2.2 Upstream
2.2.3 Downstream

Part 3. Manufacture
3.1 Manufacturing Process
3.2 Issues and Trends

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