Global Underfill Market 2016 – Henkel, WON CHEMICAL, NAMICS, SUNSTAR, Zymet

underfill-marketUnderfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.

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Scope of the Report
This report focuses on the Underfill in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE

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Market Segment by Regions
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America, Middle East and Africa

Market Segment by Type
Semiconductor Underfills
Board Level Underfills

Market Segment by Applications
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics (laptops, mobile phones, MP3 players, game consoles, digital cameras,etc.)
Automotive Electronics
Medical Electronics
Others

There are 13 Chapters to deeply display the global Underfill market report.

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