Global Underfill Market 2016 – Henkel, WON CHEMICAL, NAMICS, SUNSTAR, Zymet
Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.
Scope of the Report
This report focuses on the Underfill in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers
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Market Segment by Regions
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America, Middle East and Africa
Market Segment by Type
Board Level Underfills
Market Segment by Applications
Defense & Aerospace Electronics
Consumer Electronics (laptops, mobile phones, MP3 players, game consoles, digital cameras,etc.)
There are 13 Chapters to deeply display the global Underfill market report.