Global Chip On Flex (COF) Market 2017 by Manufacturers, Countries, Type and Application, Trends, Forecast to 2022

Chip On Flex (COF) Industry Report introduced a Market Segment, Product Types, with Sales, Revenue, Price, Market Share and Growth, focuses on top players in these regions/countries, Size, Share, Demand, Analysis, Manufacturers, Type and Application, Forecast 2017 to 2022

Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn’t have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.

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Scope of the Report:
This report focuses on the Chip On Flex (COF) in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers
LGIT
Stemco
Flexceed
Chipbond Technology
CWE
Danbond Technology
AKM Industrial
Compass Technology Company
Compunetics
STARS Microelectronics

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Market Segment by Regions
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type
Single sided COF
Others

Market Segment by Applications
Military
Medical
Aerospace
Electronics
Other

There are 15 Chapters to deeply display the global Chip On Flex (COF) market report.

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