Global Electronic Packaging Materials Market Professional Survey Report 2017

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Description

This report studies Electronic Packaging Materials in Global market, especially in North America, China, Europe, Southeast Asia, Japan and India, with production, revenue, consumption, import and export in these regions, from 2012 to 2016, and forecast to 2022.

This report focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering

EPM

International Paper Company

Mitsubishi Chemical

Alent

Cookson

Hitachi Chemical

Kyocera Chemical

LG Chem

Sumitomo Chemical

BASF

Mitsui High-tec

Henkel

Toray

Tanaka

Indium Corporation

Atotech Deutschland GmbH

Eternal Chemical

Shinko Electric Industries

AMETEK Electronic

DuPont

IEEE

By types, the market can be split into

Organic Substrates

Bonding Wires

Lead Frames

Ceramic Packages

Others

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By Application, the market can be split into

Semiconductor & IC

PCB

Others

By Regions, this report covers (we can add the regions/countries as you want)

North America

China

Europe

Southeast Asia

Japan

India

Table of Contents

Global Electronic Packaging Materials Market Professional Survey Report 2017

1 Industry Overview of Electronic Packaging Materials

1.1 Definition and Specifications of Electronic Packaging Materials

1.1.1 Definition of Electronic Packaging Materials

1.1.2 Specifications of Electronic Packaging Materials

1.2 Classification of Electronic Packaging Materials

1.2.1 Organic Substrates

1.2.2 Bonding Wires

1.2.3 Lead Frames

1.2.4 Ceramic Packages

1.2.5 Others

1.3 Applications of Electronic Packaging Materials

1.3.1 Semiconductor & IC

1.3.2 PCB

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