Global Thermal Management Technologies Market Forecast 2017 – 2022

The global market for thermal management products should reach $6.3 billion by 2022 from $4.7 billion in 2017 at a compound annual growth rate CAGR of 6.0%, from 2017 to 2022.

Report Includes

-An overview of the global market for thermal management in semiconductor microchips.

-Analyses of global market trends, with data from 2016, estimates for 2017 and projections of compound annual growth rates (CAGRs) through 2022.

-Analyses of the market types of substrate material, properties of substrate material, end-user industries, product type, and region.

-A look in to the market drivers, such as renewable energy, automotive industry, consumer appliances, and light-emitting diodes.

-Profiles of the major companies in the industry.

“Thermal management” is the term used to describe the array of materials, technologies and problem-solving tools that manufacturers apply to regulate the unwanted heat caused by the normal functioning of an electronic system. Thermal management occurs at different nodes of an integrated circuit (IC). An integrated circuit can be of three types: memory chip, microchip or microprocessor chip, and logic chip. The microchip is a semiconductor wafer that is made, layer by layer, on a metal wafer substrate of the semiconductor material on which thousands to millions of tiny transistors are arranged to perform many functions and processes.

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Microchips are also made to perform many arithmetic and logic operations, and memory operations and for special purposes such as analog-to-digital conversion, bit slicing, and gateways. This report categorizes thermal management technologies used in microchips into six product segments: heat sinks, fans and blowers, fan sinks, heat pipes, cold plates, and others (thermoelectric, pumped liquid). These segments have been chosen because they are established technologies and represent revenue markets of significant size.

Thermal management interface materials are products that stand between a heat sink and the device to be cooled. Their function is to improve the thermal transfer in the joint between the heat sink and the device to be cooled by increasing or securing the area of contact between the two surfaces. In some cases, the interface performs the job of the heat sink. This role has become increasingly common in several applications in which, due to the height or weight constraints of the system, a conventional hardware heat sink is not feasible.

This report also analyzes substrates, which are the foundations of integrated circuits, or planar components of electronic packages or modules. The report focuses on substrates that have been developed specifically to enhance the thermal handling capability of an electronic component.

Finally, this report highlights the vendor landscape. It provides detailed profiles of major companies.

Study Goals and Objectives

The report aims to provide an analysis of the most recent developments and current trends in global thermal management in the microchip marketplace. Specific objectives are:

-To identify thermal management technologies and products with the greatest commercial potential in the near term to middle term (2016 to 2022).

-To analyze the key drivers that will shape the market for thermal management technologies and products over the next five years.

-To estimate the current and future demands for thermal management technologies and products.

-To ascertain the companies that are best positioned to meet these demands because of proprietary technologies, strategic alliances, or other advantages.

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