Tag Archives: TE Connectivity

Heilind Asia Will Exhibit at L11 in Nepcon Vietnam

Nepcon Vietnam is a three-day event will be held from 11 to 13 Oct 2018 at SECC in Ho Chi Minh City. Heilind Asia will exhibit at L11, together with TE Connectivity, Alpha Wire, and other suppliers, Heilind Asia will display the latest products and solutions to visitors in Vietnam.

Hong Kong, October 09, 2018 /PressReleasePing/ – Nepcon Vietnam is a three-day event will be held from 11 to 13 Oct 2018 at SECC in Ho Chi Minh City. Heilind Asia will exhibit at L11, together with TE Connectivity, Alpha Wire, and other suppliers, Heilind Asia will display the latest products and solutions to visitors in Vietnam.

TE Connectivity Offers Portable Crimp Tools for All Market Needs

TE Connectivity (TE) provides a wide variety of portable crimp tools. TE’s SDE dies can be used across platforms from manual to pneumatic to battery-powered.

Hong Kong, October 06, 2018 /PressReleasePing/ – TE Connectivity (TE) provides a wide variety of portable crimp tools. TE’s SDE dies can be used across platforms from manual to pneumatic to battery-powered. TE also carries tools for insertion and extraction, IDC, networking applications and so much more.

TE Connectivity Announced Sliver Internal Cabled Interconnects

TE Connectivity (TE) announced Sliver internal cabled interconnect system provides a solution to data rate increase challenges. It is flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs.

Hong Kong, October 06, 2018 /PressReleasePing/ – TE Connectivity (TE) announced Sliver internal cabled interconnect system provides a solution to data rate increase challenges. It is flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs. With a 0.6mm contact pitch, Sliver products are super slim, allowing you to fit more inside the box. In addition to card-edge configurations, TE provides a highly robust metal housing design on the connector cage to help withstand cable pull while an active latch provides additional connection security. This new connectivity technology simplifies design and helps lower overall costs by eliminating the need for re-timers and more costly lower-loss PCB materials while reaching speeds up to 56 Gbps with the use of TE high speed cable.

TE Connectivity Offers MAG-MATE Terminals

TE Connectivity (TE) offers a full selection of Standard MAG-MATE Insulation Displacement Crimp (IDC) terminals for magnet wire terminations.

Hong Kong, October 05, 2018 /PressReleasePing/ – TE Connectivity (TE) offers a full selection of Standard MAG-MATE Insulation Displacement Crimp (IDC) terminals for magnet wire terminations. MAG-MATE terminals are available in poke-in, poke-in tab, splice, crimp wire barrel, solder post, quick connect tab, pin and receptacle styles. Standard MAG-MATE terminates magnet wire ranging from 34-12 AWG [0.16 -2.05 mm]. Each IDC slot size terminates a range of up to four consecutive magnet wire sizes. Two magnet wires with the same diameter can be terminated in one terminal except as noted.

TE Connectivity Announced HDSCS Connectors

TE Connectivity (TE) announced Heavy Duty Sealed Connector Series (HDSCS) which offers several cavity arrangements and mixed wire sizes.

Hong Kong, October 04, 2018 /PressReleasePing/ – TE Connectivity (TE) announced Heavy Duty Sealed Connector Series (HDSCS) which offers several cavity arrangements and mixed wire sizes. These rugged, thermoplastic connectors have a secondary lock with poke-yoke feature and can be used for in-line or flange mount applications. HDSCS connectors are available in five housing sizes and with four keying options. They are offered in arrangements ranging from 2 to 18 cavities.

TE Connectivity’s 5G Future

TE Connectivity (TE) is building the future of fast with solutions that support speeds up to 100 times those of 4G networks. With exceptionally broader bandwidth and next-generation security, 5G will be integrated into infrastructure, from monitoring power-plants to reinvigorating public transportation. It will create an interactive ecosystem of automated manufacturing, processing, retail, and agriculture.

Hong Kong, October 03, 2018 /PressReleasePing/ – TE Connectivity (TE) is building the future of fast with solutions that support speeds up to 100 times those of 4G networks. With exceptionally broader bandwidth and next-generation security, 5G will be integrated into infrastructure, from monitoring power-plants to reinvigorating public transportation. It will create an interactive ecosystem of automated manufacturing, processing, retail, and agriculture.

TE Connectivity Introduces the 48V Bus Bar Connectors & Cable Assemblies

TE Connectivity (TE) is a global leader in plug-and-play power bus bar and cable assembly solutions for Open Compute Project (OCP) distribution architecture, to get a standardized platform for simple system designs. These solutions are fully compatible with specifications for use in rack-level bus bar applications including power shelf, BBU shelf, IT tray/cubby shelf and server sleds. TE offers numerous cable assembly configurations to address many special design requirements.

TE Connectivity Introduces the Free Height Connectors

TE Connectivity (TE)’s free height connectors provide a range of position sizes from 40 – 440 positions in contact pitches of 0.5, 0.6, 0.8, and 1.0mm, and by mating various combinations of vertical plug and receptacle housing heights, board-to-board stack heights from 4-20mm can be achieved in 1mm increments.

Hong Kong, September 30, 2018 /PressReleasePing/ – TE Connectivity (TE)’s free height connectors provide a range of position sizes from 40 – 440 positions in contact pitches of 0.5, 0.6, 0.8, and 1.0mm, and by mating various combinations of vertical plug and receptacle housing heights, board-to-board stack heights from 4-20mm can be achieved in 1mm increments.

TE Connectivity Introduces the SAS Drive Connectors

TE Connectivity (TE)’s Small Form Factor (SFF) standard connectors are designed to support differential signalling and drive performance.

Hong Kong, September 27, 2018 /PressReleasePing/ – TE Connectivity (TE)’s Small Form Factor (SFF) standard connectors are designed to support differential signalling and drive performance.

TE Connectivity Introduces Z-PACK TinMan Connectors

TE Connectivity (TE) Introduces Z-PACK TinMan connectors increase system performance within the interconnection channel with a proven performer which reduces the system characteristic impedance from 100 ohm to 85 ohm

Hong Kong, September 27, 2018 /PressReleasePing/ – TE Connectivity (TE)’s Z-PACK TinMan connectors increase system performance within the interconnection channel with a proven performer which reduces the system characteristic impedance from 100 ohm to 85 ohm.

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