Tag Archives: THE EDGE

Epson RX8804 Series Real-Time Clock Module Featured in THE EDGE by Future Electronics

Montreal, Canada (bizpr) March 13, 2020 – Future Electronics, a ****** leading distributor of electronic components, is featuring the RX8804 RTC module by Epson in this month’s edition of THE EDGE.

Epson’s real time clock module (XA3) and the XB3 module, both from the RX8804 series, feature high reliability and a wide operating temperature for use in a variety of applications such as home automation, medical, green energy and factory automation environments. It is designed for ultra-precise time keeping and uses the latest technology to achieve accuracy, lower power consumption and longer battery life.

E-Switch Features the TL3330 Series SMT Right Angle Tactile Switch in THE EDGE by Future Electronics

Montreal, Canada (bizpr) March 12, 2020 – Future Electronics, a ****** leading distributor of electronic components, is featuring the E-Switch TL3330 series right angle tactile switch in this month’s edition of THE EDGE.

The TL3330 series SMT right angle tactile switch has a small profile that works great for many applications such as consumer electronics, medical equipment, audio visual, telecommunications, computers and more. There are two gram force options to choose from and this tact switch comes with silver contacts and a gull wing termination.

Hirose FH64MA Flat Printed Circuit Connector Featured in THE EDGE by Future Electronics

Montreal, Canada (bizpr) March 11, 2020 – Future Electronics, a ****** leading distributor of electronic components, is featuring the Hirose FH64MA Series Flat Printed Circuit Connector in this month’s edition of THE EDGE.

The Hirose FH64MA Series features two different connectors: an 11 position mounting type FPC and a 15 position connector. Their reduced thickness accommodates the height of main components used in most smart devices. There are several FPCs on the main board, but the FH64MA Series connector’s super low profile feature allows it to be mounted in the narrow dead space between FPCs and the main board to utilize space. Two design features ensure excellent FPC retention force: metal locking tabs that catch the FPC tabs, and the sharp edge on the lower contact beam that presses into the FPC stiffener. This connector is great for applications requiring high-density packaging.

Microchip Features AVR & PIC Bluetooth® Low Energy Development Boards in THE EDGE by Future Electronics

Montreal, Canada (bizpr) March 10, 2020 – Future Electronics, a ****** leading distributor of electronic components, is introducing new solutions for wireless applications development by Microchip in this month’s edition of THE EDGE.

Microchip’s Bluetooth® Low Energy Development Boards feature powerful microcontrollers – an eXtreme Low Power PIC16LF18456 and an AVR ATmega3208 – both equipped with a CryptoAuthentication™ secure element. This is an important piece of IoT security that prevents cybercriminals from accessing data stored on devices.

The boards not only allow simple drag-and-drop programming, but also full programmer and debugger capabilities supported by two award-winning Integrated Development Environments (IDEs) – Atmel Studio and Microchip MPLAB® X IDE – giving you the freedom to innovate with your environment of choice.

Panasonic PAN1326C2 Series Bluetooth® RF Module Featured in The Edge by Future Electronics

Montreal, Canada (bizpr) March 9, 2020 – Future Electronics, a ****** leading distributor of electronic components, is featuring a Bluetooth® implementation module by Panasonic in this month’s edition of THE EDGE.

This Panasonic PAN1326C2 Bluetooth 4.2-compliant Host Controlled Interface (HCI) brings Texas Instrument’s seventh-generation Bluetooth® core integrated circuit to an easy-to-use format. The PAN1326C2 offers best-in-class RF performance, increased range and a tiny footprint with as little as two layers, making it the ideal Bluetooth module for space-constrained applications and more. The module is 100% pin compatible with previous generations of TI-based Bluetooth HCI modules.

Top-Performing STM32H7 MCUs from STMicroelectronics Featured in THE EDGE by Future Electronics

Montreal, Canada (bizpr) February 11, 2020 – Future Electronics, a ****** leading distributor of electronic components, is featuring top-performing ARM Cortex-M7 MCUs from STMicroelectronics in the latest edition of THE EDGE.

The ARM Cortex-M7-based STM32H7 MCU series leverages ST’s Non-Volatile-Memory (NVM) technology to reach the industry’s highest benchmark scores for Cortex-M-based microcontrollers, with up to 1327 DMIPS/ 3224 CoreMark executing from embedded Flash memory.

THE EDGE is the latest e-newsletter from Future Electronics, and is geared toward engineers and buyers looking for new or leading-edge products. THE EDGE comes out twice per month, and each edition features product information, datasheets and videos showcasing the most advanced new technology in a specific area, such as sensing, lighting, or automotive.

Gen 1.5 SiC Schottky Diodes from ON Semiconductor Featured in THE EDGE by Future Electronics

Montreal, Canada (bizpr) February 10, 2020 – Future Electronics, a ****** leading distributor of electronic components, is featuring high-performance and reliable SiC Schottky Diodes from ON Semiconductor in the latest edition of THE EDGE.

ON Semiconductor’s Gen 1.5 SiC Schottky Diodes feature no reverse recovery current, temperature independent switching, and excellent thermal performance. System benefits include high efficiency, fast operating frequency, high power density, low EMI, and reduced system size and cost. They are available in 650V, 1200V, and 1700V devices in a range of current and package options, making them ideal for next-generation power system designs.

i.MX 8M Nano Applications Processor from NXP Featured in THE EDGE by Future Electronics

Montreal, Canada (bizpr) February 7, 2020 – Future Electronics, a ****** leading distributor of electronic components, is featuring an applications processor for secure and affordable edge computing from NXP in the latest edition of THE EDGE.

The i.MX 8M Nano applications processor, based on up to 4x Arm Cortex-A53 cores and 1x Arm Cortex-M7 core, features an extensive set of media-centric peripherals designed to take the user experience to the next level. It delivers cost-effective integration and affordable performance for smart, connected, power-efficient devices that require graphics, vision, voice control, intelligent sensing and general-purpose processing.

i.MX RT106A MCU for Alexa Voice Service from NXP Featured in THE EDGE by Future Electronics

Montreal, Canada (bizpr) January 28, 2020 – Future Electronics, a ****** leading distributor of electronic components, is featuring an MCU-based AVS solution from NXP in the latest edition of THE EDGE.

NXP’s i.MX RT106A Alexa Voice Service solution enables system designers to easily and inexpensively add voice control capabilities to a wide variety of smart applications. It provides OEMs with a fully integrated, self-contained, software and hardware solution that includes the i.MX RT106A MCU and a software implementation of a machine learning audio front end for far-field audio processing. This cost-effective, easy to use AVS implementation facilitates the demand for ubiquitous voice control embedded in a wide variety of products across home, commercial and industrial applications.

ARJM11 RJ45 Jacks with Internal Magnetics from Abracon Featured in THE EDGE by Future Electronics

Montreal, Canada (bizpr) January 27, 2020 – Future Electronics, a ****** leading distributor of electronic components, is featuring RJ45 jacks with internal magnetics from Abracon in the latest edition of THE EDGE.

The ARJM11 series of RJ45 jacks with internal magnetics supports a wide range of configurations in 10/100Base-T, 1000Base-T, 2.5GBase-T and 5GBase-T applications. This series offers the ability to mix and match physical orientation of the tab, pin layouts, EMI fingers, LED colors and plating options while providing PoE and PoE+ options for 10/100Base-T rates.

EYSLCNZWW 2Mbps BLE Module from Taiyo Yuden Featured in THE EDGE by Future Electronics

Montreal, Canada (bizpr) January 25, 2020 – Future Electronics, a ****** leading distributor of electronic components, is featuring affordable BLE modules from Taiyo Yuden in the latest edition of THE EDGE.

The EYSLCNZWW is based on Nordic Semiconductor’s nRF52810 chip, and its design provides the ability to easily add Bluetooth 5 connectivity for a wide range of applications. It has an ARM Cortex M4 32bit processor, 192KB flash and 24KB RAM, with +4dBm output power and single power supply range from 1.7 – 3.6V. This is a FCC, ISED and Japan qualified module with onboard antenna in a compact 9.6 x 12.9 x 2.0 mm package.